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| Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 TC1240 Positive Doubling Charge Pump with Shutdown in SOT Package FEATURES I I I I I I I I I Space Saving 6-Pin SOT-23A Package >99% Typical Voltage Conversion Efficiency Voltage Doubling Operates from +2.5V to +4.0V Low Output Resistance (17 Typical) Only Two External Capacitors Required Consumes 180A (Typical) in Active Mode Power-Saving Shutdown Mode (1A Maximum) Fully Compliant with 1.8V Logic Sytems GENERAL DESCRIPTION The TC1240 is a doubling CMOS charge-pump voltage converter in a small 6-Pin SOT-23A package. TC1240 doubles an input voltage which can range from +2.5V to +4.0V. Conversion efficiency is typically >99%. Internal oscillator frequency is 160kHz for the TC1240. The TC1240 has an active high shutdown which limits the current consumption of the device to less than 1A. External component requirement is only two capacitors for standard voltage doubler applications. All other circuitry, including control, oscillator, power MOSFETs are integrated on-chip. Typical supply current is 180A and the device is available in a 6-Pin SOT-23A surface mount package. APPLICATIONS I I I I I Cellular Phones Pagers PDAs, Portable Data Loggers Battery-Powered Devices Handheld Instruments ORDERING INFORMATION Part Number TC1240ECH Package 6-Pin SOT-23A Temp. Range -40C to +85C TYPICAL OPERATING CIRCUIT PIN CONFIGURATION Positive Voltage Doubler C+ C 1 C- SHDN TC1240 ON OFF 6-Pin SOT-23A INPUT VIN 1 6 C+ VIN GND 2 TC1240ECH 5 OUT OUT GND C2 2 x INPUT C- 3 4 SHDN NOTE: *6-Pin SOT-23A is equivalent to EIAJ SC-74 TC1240-1 7/7/00 DS21333A 1 (c) 2001 Microchip Technology Inc. Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 ABSOLUTE MAXIMUM RATINGS* Input Voltage (VIN to GND) .......................... +4.5V, -0.3V Output Voltage (OUT to GND) .............. +9.0V, VIN - 0.3V Current at OUT Pin ................................................. 50 mA Short-Circuit Duration -OUT to GND ................ Indefinite Operating Temperature Range ...............-40 C to +85C Power Dissipation (TA 70C) 6-Pin SOT-23A ..........................................240 mW Storage Temperature (Unbiased) ......... -65 C to +150C Lead Temperature (Soldering, 10 sec) ................. +300C *Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to Absolute Maximum Rating Conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS: TA = -40 to +85 C, VIN = +2.8V, C1 = C2 = 3.3F , SHDN = GND, unless otherwise noted. Typical values are at TA = +25C. Symbol IDD ISHDN VMIN VMAX FOSC FSW VIH VIL PEFF VEFF ROUT Parameter Supply Current Shutdown Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency Switching Frequency Shutdown Input Logic High Shutdown Input Logic Low Power Efficiency Voltage Conversion Efficiency Output Resistance (Note 1) Test Conditions RLOAD = SHDN = VIN RLOAD = 1.0K RLOAD = 1.0K TA = -40 C to +85C TA = -40 C to +85C VIN = VMIN to VMAX VIN = VMIN to VMAX RLOAD = 1.0K RLOAD = RLOAD = 1.0K TA = -40C to +85C Min -- -- 2.5 -- -- 40 1.4 -- 86 97.5 -- -- Typ 180 0.1 -- -- 160 80 -- -- 93 99.96 17 -- Max 300 1.0 -- 4.0 -- 125 -- 0.4 -- -- -- 30 Units A A V V kHz kHz V V % % NOTE: 1. Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / pump frequency x capacitance)]. 2. Switching frequency is one-half internal oscillator frequency. PIN DESCRIPTION Pin No. (6-Pin SOT-23A) 1 2 3 4 5 6 Symbol VIN GND C- SHDN OUT C+ Description Power Supply Input. Ground. Commutation Capacitor Negative Terminal. Shutdown Input (Active High). Doubled Output Voltage. Commutation Capacitor Positive Terminal. TC1240-1 7/7/00 DS21333A 2 (c) 2001 Microchip Technology Inc. Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 DETAILED DESCRIPTION The TC1240 charge pump converter doubles the voltage applied to the VIN pin. Conversion consists of a twophase operation (Figure 1). During the first phase, switches S2 and S4 are open and S1 and S3 are closed. During this time, C1 charges to the voltage on VIN and load current is supplied from C2. During the second phase, S2 and S4 are closed, and S1 and S3 are open. During this second phase, C1 is level shifted upward by VIN volts. This connects C1 to the reservoir capacitor C2, allowing energy to be delivered to the output as needed. The actual voltage is slightly lower than 2 x VIN since the four switches (S1 - S4) have an on-resistance and the load drains charge from reservoir capacitor C2. S2 (2) I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. (3) Charge pump capacitor losses due to effective series resistance (ESR). (4) Losses that occur during charge transfer (from commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exists. Most of the conversion losses are due to factors (2) and (3) above. These losses are given by Equation 1(b). (a) PLOSS (2, 3) = IOUT 2 x ROUT (b) IOUT2 x [(f 1 PUMP) +8RSWITCH + 4ESRC1 + ESRC2 C1 Equation 1. ] S1 VIN C1 TC1240 OUT = 2 x VIN C2 S3 S4 The pump frequency in Equation 1(b) is defined as onehalf the oscillator frequency (i.e. fPUMP = fOSC/2). The 1/(fPUMP)(C1) term in Equation 1(b) is the effective output resistance of an ideal switched capacitor circuit (Figures 2a, 2b). The value of RSWITCH can be approximated at 1.4 for the TC1240. The remaining losses in the circuit are due to factor (4) above, and are shown in Equation 2. The output voltage ripple is given by Equation 3. PLOSS(4) = [(0.5)(C1) (4VIN2- VOUT2 ) + (0.5)(C2)(2VOUT VRIPPLE - VRIPPLE2 )] x fOSC Equation 2. VIN OSC Figure 1. Ideal Swiched Capacitor Charge Pump Doubler APPLICATIONS INFORMATION Output Voltage Considerations TheTC1240 performs voltage doubling but does not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 17 nominal at +25C and VIN = +2.8V. VOUT is approximately +5.6V at light loads, and droops according to the equation below: VDROOP = IOUT x ROUT VOUT = 2 x VIN - VDROOP V+ VRIPPLE = IOUT +2(IOUT)(ESRC2) (fOSC)(C2) Equation 3. f VOUT RL C1 C2 Figure 2a. Ideal Swiched Capacitor Model REQUIV V+ REQUIV = 1 f x C1 Charge Pump Efficiency The overall power efficiency of the charge pump is affected by four factors: (1) Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). TC1240-1 7/7/00 DS21333A VOUT C2 RL Figure 2b. Equivalent Output Resistance 3 (c) 2001 Microchip Technology Inc. Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 CAPACITOR SELECTION In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 will lower the output resistance and larger values of C2 will reduce output ripple. (See Equation 1(b)). Table 1 shows various values of C1 and the corresponding output resistance values @ +25C. It assumes a 0.1 ESRC1 and 1.2 RSW. Table 2 shows the output voltage ripple for various values of C2. The VRIPPLE values assume 5 mA output load current and 0.1 ESRC2. Table 1. Output Resistance vs. C1 (ESR = 0.1) C1 (F) 0.47 1 2.2 3.3 4.7 10 47 100 TC1240 ROUT() 47 28.5 19.5 17 15.5 13.6 12.5 12.2 C3 VIN VOUT 5 OUT C1+ C 6 C2 TC1240 1 VIN 3 -- C C1 4 SHDN GND 2 C1 RL Device TC1240 C1 3.3F C2 3.3F C3 3.3F Voltage Doubler Figure 3. Test Circuit VOLTAGE DOUBLER The most common application for charge pump devices is the doubler (Figure 3). This application uses two external capacitors - C1 and C2 (plus a power supply bypass capacitor, if necessary). The output is equal to 2 x VIN minus any voltage drops due to loading. Refer to Table 1 and Table 2 for capacitor selection. V IN Table 2. Output Voltage Ripple vs. C2 (ESR = 0.1) IOUT 5mA C1 (F) 0.47 1 2.2 3.3 4.7 10 47 100 TC1240 VRIPPLE (mV) 142 67 30 20 14 6.7 2.5 1.6 6 C+ C1A 2 VIN 1 6 C1B C+ VIN 1 TC1240 GND 2 GND TC1240 3 C- 4 SHDN "1" OUT 5 C2A 3 4 C- SHDN "n" OUT 5 VOUT C2B VOUT = (n + 1)VIN Figure 4. Cascading Multiple Devies to Increase Output Voltage INPUT SUPPLY BYPASSING The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. The recommended capacitor should be a large value (at least equal to C1) connected from the input to GND. CASCADING DEVICES Two or more TC1240s can be cascaded to increase output voltage (Figure 4). If the output is lightly loaded, it will be close to ((n + 1) x VIN) but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. For the case of the two-stage `tripler'output resistance can be approximated as ROUT = 2 x ROUT1 + ROUT2, where ROUT1 is the output resistance of the first stage, and ROUT2 is the output resistance of the second stage. 4 (c) 2001 Microchip Technology Inc. SHUTDOWN INPUT TheTC1240 is disabled when SHDN is high, and enabled when SHDN is low. This input cannot be allowed to float. TC1240-1 7/7/00 DS21333A Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 ROUT = ROUT OF SINGLE DEVICE NUMBER OF DEVICES VIN 1 3 2 6 4 TC1240 C1B 3 TC1240 2 "n" 6 4 SHDN ... C2 Shutdown Control 5 ... 1 VIN However, to preserve ripple performance the value of C2 should be scaled according to the number of paralleled TC1240s. LAYOUT CONSIDERATIONS As with any switching power supply circuit good layout practice is recommended. Mount components as close together as possible to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry. C1A "1" SHDN 5 VOUT TC1240 DEMO CARD VOUT = 2 x VIN Figure 5. Paralleling Multiple Devices to Reduce Output Resistance PARALLELING DEVICES To reduce the value of ROUT, multiple TC1240s can be connected in parallel (Figure 5). The output resistance will be reduced by a factor of N where N is the number of TC1240s. Each device will require its own pump capacitor (C1x), but all devices may share one resevoir capacitor (C2). The TC1240 Demo Card is a 1.25" x 1.0" card containing a TC1240 and all of the necessary external components that allow the user to evaluate the device's ability to generate a 2X non-regulated output voltage. The demo card is fully assembled with the required external capacitors along with a variable load resistor that allows the user to vary the output load current of the output stage. For convenience, several test points and jumpers are available for measuring various voltages and currents on the circuit board. Figure 6. TC1240 Demo Card Schematic TC1240-1 7/7/00 DS21333A 5 (c) 2001 Microchip Technology Inc. Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 Figure 7. TC1240 Demo Card Assembly Drawing and Artwork Figure 6 is a schematic of the TC1240 Demo Card, and Figure 7 shows the assembly drawing and artwork for the board. Table 3 lists the voltages that are monitored by the test points and Table 4 lists the currents that can be measured using the jumpers or the specific jumper function. Table 3. TC1240 Demo Card Test Points TEST POINT TP1 TP2 TP3 TP4 TP5 TP6 TP7 VOLTAGE MEASUREMENT DEMO CARD POWER SUPPLY INPUT[+2.5V to +4.0V] GROUND GROUND TC1240 OUTPUT (2 x VIN) TC1240 SHDN INPUT TC1240 VIN SUPPLY VOLTAGE EXTERNAL SHDN INPUT Table 4. TC1240 Demo Card Jumpers JUMPER J1 J2 J3 J4 CURRENT MEASUREMENT / JUMPER FUNCTION TC1240 QUIESCENT CURRENT TC1240 LOAD CURRENT TC1240 SHDN INPUT CURRENT CONNECT EXTERNAL SHDN INPUT TO VIN (i.e. SHDN ENABLE) (c) 2001 Microchip Technology Inc. 6 TC1240-1 7/7/00 DS21333A Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 TYPICAL CHARACTERISTICS 700 600 500 400 300 200 100 0 2.00 Supply Current vs. Supply Voltage (No Load) 3.00 4.00 5.00 6.00 Supply Voltage (V) 450 400 350 300 250 200 150 100 50 0 -50 Supply Current vs. Temperature (No Load) VIN = 4.0V VIN = 2.8V -25 0 25 50 75 Temperature (C) 100 125 Output Source Resistance vs. Supply Voltage (with Rload = 1K) 20 15 15 25 20 Output Source Resistance vs. Temperature (with Rload = 1K) VIN = 2.8V VIN = 4.0V 10 10 5 5 0 2.00 3.00 4.00 Supply Voltage (V) 5.00 6.00 0 -50 -25 0 25 50 75 Temperature (C) 100 125 Output Voltage Drop Vs Load Current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 100% 90% 80% Power Efficiency Vs Load Current VIN = 4.0V VIN = 2.5V VIN = 3.5V VIN = 2.8V VIN = 4.0V 70% 60% 50% 40% 30% 20% 10% \ 25 30 35 40 45 50 0% 0 5 10 15 20 25 30 35 40 45 50 Load Current (mA) Load Current (mA) TC1240-1 7/7/00 DS21333A 7 (c) 2001 Microchip Technology Inc. Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 TYPICAL CHARACTERISTICS (Cont.) SWITCHING FREQUENCY (KHz) MARKING 6-Pin SOT-23A Switching Frequency vs. Temperature 100 80 60 40 20 0 -50 V IN = 4.0V V IN = 2.8V 3 & -25 0 25 50 75 100 125 represent part number code + temperature range (two-digit code) Code DN D N TC1240 1240ECH Ex: 1240ECH = TEMPERATURE (C) represents year and 2-month code represents lot ID number TAPING FORM Component Taping Orientation for 6-Pin SOT-23A (EIAJ SC-74) Devices PIN 1 User Direction of Feed Device Marking Device Marking User Direction of Feed W PIN 1 P Standard Reel Component Orientation For TR Suffix Device (Mark Right Side Up) Reverse Reel Component Orientation For RT Suffix Device (Mark Upside Down) Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 6-Pin SOT-23A 8 mm 4 mm 3000 7 in (c) 2001 Microchip Technology Inc. 8 TC1240-1 7/7/00 DS21333A Positive Doubling Charge Pump with Shutdown in SOT Package TC1240 PACKAGE DIMENSIONS 6-Pin SOT-23A (EIAJ SC-74) .075 (1.90) REF. .122 (3.10) .098 (2.50) .020 (0.50) .014 (0.35) .069 (1.75) .059 (1.50) .037 (0.95) REF. .118 (3.00) .110 (2.80) .057 (1.45) .035 (0.90) .006 (0.15) .000 (0.00) 10 MAX. .024 (0.60) .004 (0.10) .008 (0.20) .004 (0.09) Dimensions: inches (mm) TC1240-1 7/7/00 DS21333A 9 (c) 2001 Microchip Technology Inc. TC1240 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, KEELOQ, SEEVAL, MPLAB and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Total Endurance, ICSP, In-Circuit Serial Programming, FilterLab, MXDEV, microID, FlexROM, fuzzyLAB, MPASM, MPLINK, MPLIB, PICC, PICDEM, PICDEM.net, ICEPIC, Migratable Memory, FanSense, ECONOMONITOR, Select Mode and microPort are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Term Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2001, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 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